| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To surely fill a concave portion between internal layer copper circuits with a resin, provide sufficient smoothness of the surface of the manufactured copper-clad laminate including internal layer circuit, and eliminate peeling between the internal layer copper circuit and insulated layer during the process using drills for laminating, via a prepleg layer, a copper foil 4 to the internal layer circuit board 1 in which the copper circuit 12 in the thickness of 100μm or more is arranged and then integrating these elements with the thermal pressure molding process. <P>SOLUTION: As the prepleg layer 2 which is in contact with the internal layer circuit board 1, a glass-fiber woven basic material in the thickness of 60μm or less is used. As the prepleg layer 3 allocated in the external side of the prepleg layer 2, a glass-fiber woven basic material in the thickness of 100μm or more is used. When the insulated substrate 11 of the internal layer circuit board 1 is formed with the thermal pressure molding process of the prepleg layer of the glass-fiber unwoven basic material, the surface smoothness can further be improved. <P>COPYRIGHT: (C)2004,JPO</p> |
