发明名称 MULTILAYER PRINTED CIRCUIT BOARD AND ITS MANUFACTURING PROCESS
摘要 PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board in which electric connectability and connection reliability are not lowered by using a core circuit board composed of a metal plate. SOLUTION: A through-hole 32 of the core circuit board 30 is filled with resin 36 to form a through hole 41. The corner of an opening in the through hole 32A of the metal plate 30A is covered with a metal layer 34. The corner does not contact a resin side 36, and no stress concentration occurs in the opening of the through hole 32, so that no crack is generated in the resin 36. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004140216(A) 申请公布日期 2004.05.13
申请号 JP20020304212 申请日期 2002.10.18
申请人 IBIDEN CO LTD 发明人 INAGAKI YASUSHI;TAKENAKA YOSHINORI;O TOUTO
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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