发明名称 Induction bondable high-pressure laminate
摘要 The present invention relates to novel high-pressure laminate constructions that can be bonded to a substrate through the use of electromagnetic energy. Specifically, high-pressure laminates are made which incorporate or have bonded thereto a susceptor element which absorbs electromagnetic energy, generating heat sufficient to melt or activate an intermediate adhesive for bonding the laminate to a substrate. In a preferred embodiment, the high-pressure laminates have a pre-applied heat sensitive adhesive.
申请公布号 US2004091694(A1) 申请公布日期 2004.05.13
申请号 US20030630270 申请日期 2003.07.30
申请人 HOLZER MARK R.;KROPP PHILIP L. 发明人 HOLZER MARK R.;KROPP PHILIP L.
分类号 B29C35/02;B29C35/08;B32B27/42;B32B29/02;H05B6/02;(IPC1-7):B32B5/16 主分类号 B29C35/02
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