发明名称 |
Induction bondable high-pressure laminate |
摘要 |
The present invention relates to novel high-pressure laminate constructions that can be bonded to a substrate through the use of electromagnetic energy. Specifically, high-pressure laminates are made which incorporate or have bonded thereto a susceptor element which absorbs electromagnetic energy, generating heat sufficient to melt or activate an intermediate adhesive for bonding the laminate to a substrate. In a preferred embodiment, the high-pressure laminates have a pre-applied heat sensitive adhesive.
|
申请公布号 |
US2004091694(A1) |
申请公布日期 |
2004.05.13 |
申请号 |
US20030630270 |
申请日期 |
2003.07.30 |
申请人 |
HOLZER MARK R.;KROPP PHILIP L. |
发明人 |
HOLZER MARK R.;KROPP PHILIP L. |
分类号 |
B29C35/02;B29C35/08;B32B27/42;B32B29/02;H05B6/02;(IPC1-7):B32B5/16 |
主分类号 |
B29C35/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|