发明名称 |
Semiconductor integrated circuit and semiconductor substrate of the same |
摘要 |
In a semiconductor integrated circuit, a P-type epitaxial layer is provided on the entire surface of a P-type bulk substrate. The resistivity of the P-type bulk substrate is set to 1000 Omega.cm, and the thickness and the resistivity of the P-type epitaxial layer is set to 5 mum and 10 Omega.cm, respectively. Then, a digital section and an analog section are provided remote from each other on the P-type epitaxial layer, where a digital circuit and an analog circuit are formed on the digital section and analog section, respectively. Further a device isolation region reaching the P-type bulk substrate is formed in a region between the digital section and analog section of the P-type epitaxial layer.
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申请公布号 |
US2004089901(A1) |
申请公布日期 |
2004.05.13 |
申请号 |
US20030695969 |
申请日期 |
2003.10.29 |
申请人 |
OHKUBO HIROAKI;KIKUCHI HIROAKI;FURUMIYA MASAYUKI;YAMAMOTO RYOUTA;NAKASHIBA YASUTAKA |
发明人 |
OHKUBO HIROAKI;KIKUCHI HIROAKI;FURUMIYA MASAYUKI;YAMAMOTO RYOUTA;NAKASHIBA YASUTAKA |
分类号 |
H01L27/04;H01L21/76;H01L21/822;H01L21/84;H01L27/12;(IPC1-7):H01L27/01 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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