发明名称 |
Thin film transistor array panel and method for fabricating the same |
摘要 |
A TFT array panel and a method for fabricating the same is disclosed, wherein an adhesion force between an elongated wire and a TFT array panel pad is improved by increasing the contact area of a bonding pad. The TFT array panel pad includes a first conductive layer formed in a pad region on an insulating substrate. The first conductive layer includes a plurality of conductive islands and holes. A second conductive layer is formed over and covers the first conductive layer.
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申请公布号 |
US2004089884(A1) |
申请公布日期 |
2004.05.13 |
申请号 |
US20030703582 |
申请日期 |
2003.11.10 |
申请人 |
CHOO KYO SEOP;PARK JUNE HO |
发明人 |
CHOO KYO SEOP;PARK JUNE HO |
分类号 |
G02F1/136;H01L21/77;H01L21/84;H01L27/12;H01L27/146;H01L31/0272;(IPC1-7):H01L29/80 |
主分类号 |
G02F1/136 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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