发明名称 |
Method of and apparatus for making heat-sensitive stencil and heat-sensitive stencil material |
摘要 |
When thermally perforating a thermoplastic resin film of heat-sensitive stencil material by the use of a thermal head, supply of energy to the thermal head is cut at a time the diameter of the perforations becomes not smaller than 65% and not larger than 95% of a target diameter of the perforations.
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申请公布号 |
US2004089172(A1) |
申请公布日期 |
2004.05.13 |
申请号 |
US20030641005 |
申请日期 |
2003.08.15 |
申请人 |
RISO KAGAKU CORPORATION |
发明人 |
NAKAMURA JUN;OHSHIMA KENJI |
分类号 |
B41C1/055;B32B3/24;B32B27/00;B41C1/14;B41N1/24;(IPC1-7):B41N1/24 |
主分类号 |
B41C1/055 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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