发明名称 Thermal injection and proportioning head, method for making same and functionalising or addressing system comprising same
摘要 Injection and proportioning head with at least one thermal injection and proportioning device to supply a determined quantity of liquid, comprising: a hollowed out plane substrate (21) forming a liquid reservoir and covered, in order, by an unconstrained dielectric insulating membrane (22, 23) with a high thermal resistance, and then an etched semi conducting layer forming the heating resistance (25); an orifice (24) enabling fluid communication with said liquid reservoir passing through said membrane and said semi conducting layer; a photolithographed resin layer in the form of a nozzle (27) on said membrane, the duct (28) of said nozzle being in line with said orifice and the volume of said duct being such that the determined quantity of the liquid to be supplied can be controlled. Process for manufacturing this head. Functionalisation or addressing system, particularly for chemical or biochemical micro reactors comprising this head.
申请公布号 US2004090483(A1) 申请公布日期 2004.05.13
申请号 US20030332240 申请日期 2003.01.03
申请人 GUE ANNE-MARIE;ESTEVE DANIEL;CONEDERA VERONIQUE;FABRE NORBERT 发明人 GUE ANNE-MARIE;ESTEVE DANIEL;CONEDERA VERONIQUE;FABRE NORBERT
分类号 B05B1/02;B01J4/02;B01J19/00;B01L3/02;B05C5/00;B41J2/14;B41J2/16;C40B60/14;G01N35/10;(IPC1-7):B41J2/015 主分类号 B05B1/02
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