发明名称 Anodization device and anodization method
摘要 In an anodization apparatus and an anodization method for electrochemically treating a target substrate by irradiating the target substrate with light, treatment of a large target substrate can be made possible with smaller constituent elements. The electrical contact with the target substrate by a contact member is realized by a plurality of contact members or by the movement of a contact member to change the electrical contact position. The target substrate is manufactured in advance so as to have such a structure that portions thereof to be in contact with the plural contact members are connected to portions of a conductive layer on a treatment part thereof respectively. When the combination of this target substrate and the contact member(s) is used, and the electric current is passed through a part of the contact members, using a changeover switch, or the electric current passed through the contact member is applied to a portion of the conductive layer of the target substrate by the movement of the contact member, it is made possible to reduce the value of the electric current necessary for the treatment to an amount required only for the portion of the treatment part.
申请公布号 US2004089552(A1) 申请公布日期 2004.05.13
申请号 US20030471574 申请日期 2003.09.12
申请人 YAGI YASUSHI;AOKI KAZUTSUGU;USHIJIMA MITSURU 发明人 YAGI YASUSHI;AOKI KAZUTSUGU;USHIJIMA MITSURU
分类号 C25D11/32;C25D11/02;C25D17/00;C25D21/00;H01J9/02;H01L21/3063;(IPC1-7):C25D5/00 主分类号 C25D11/32
代理机构 代理人
主权项
地址