| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique which can solve the problems such as damage of a surface of an IC chip which is to be caused by heat crimping in flip chip mounting, deficient of bonding, generation of electric interference between the IC chip and a substrate, and low connection reliability, in a data carrier of a non-contact type wherein an antenna coil and the IC chip are held with base substance, the IC chip is connected with and mounted on a terminal part for connection of the base substance by a flip chip system, and the IC chip and the antenna coil are electrically connected, and to provide a manufacturing method of the non-contact data carrier. <P>SOLUTION: In the non-contact data carrier, the antenna coil and the IC chip are held with the base substance, the IC chip is subjected to bump connection with the terminal for connection of the base substance by a flip chip system via a layer of adhesives before curing which is arranged on the terminal for connection of the base substance, and the IC chip and the antenna coil are electrically connected. Hardened adhesives with which a part between the IC chip and the base substance is filled and which fixes the IC chip and its peripheral part is arranged. Distance between a bump forming surface of the IC chip and the terminal for connection of the base substance which holds the IC chip is at least 1 μm. <P>COPYRIGHT: (C)2004,JPO |
