| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board capable of sufficiently resisting heat stress even when long heat historys are repeatedly impressed and having high connection reliability in which disconnection or the like can be suppressed. <P>SOLUTION: The wiring substrate is constituted by insulating layers 4 containing epoxy resin and wiring conductor layers 5 consisting of copper plating which are alternately laminated on the surface of a core substrate 3. Wiring conductors 2 consisting of copper foil are embedded in an insulating substrate 1 obtained by impregnating an allyl denaturated polyphenylene ether resin in a heat-resisting fiber base material, so that the surfaces of the wiring conductors 2 are aligned to the same surface of the insulating substrate 1. The wiring conductors 2 with rough side faces 2a are embedded in the insulating substrate 1 by filling epoxy resin between the side faces 2a and the insulating substrate 1. <P>COPYRIGHT: (C)2004,JPO</p> |
