| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless gold plating solution which is excellent in stability and can form a uniform electroless gold plating film excellent in adhesiveness while greatly suppressing the corrosion of a substrate metal. SOLUTION: The electroless gold plating solution is an aqueous solution containing a water-soluble gold salt, a complexing agent, and a sulfite adduct of an aldehyde. Preferably, the solution contains 0.0005-0.03 mol/L in terms of gold ion of water-soluble gold salt, at least 0.00025 mol/L complexing agent, and 0.0005-0.5 mol/L sulfite adduct of an aldehyde. COPYRIGHT: (C)2004,JPO
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