| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal heater in which temperature variations of the semiconductor wafer or the like at heating are small and these can be heated rapidly, and which has no warping or bending in the metal plate. SOLUTION: This is a metal heater that is constructed of a metal plate and a heating element. The metal plate has a thickness of 50 mm or less and its roughness of the surface is 50μm or less. The felly of the region in which the above heating element is formed is located within 25% or less of the diameter of the above metal plate from the circumference of the metal plate. COPYRIGHT: (C)2004,JPO
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