| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrical apparatus with its efficiency increased in radiating heat transmitted from a heat-producing component and with its component mounting area enlarged. SOLUTION: Two substrates 2u, 2d are arranged one upon the other, and are partly bonded to each other. The lower substrate 2d of the bonded part is fixed to the inner bottom surface D of a metal case 6. A part of the upper substrate 2u not above the bonded part is energized by a spring 7 so that a heat-producing component 32t mounted on the upper substrate 2u is pressed to the metal case 6. COPYRIGHT: (C)2004,JPO
|
