Ultra thin semiconductor device

摘要

An ultra thin semiconductor device has a lead frame for holding a chip and an encapsulant sealing the chip and the lead frame. The lead frame has a die pad and multiple leads for wire bonding with the chip. A die recess to hold the chip is defined in the die pad. A depth of the die recess decreases a total height of the chip and the die pad to provide the wires enough bonding space. That is, the semiconductor device easily has a 0.4 mm thickness to be an ultra thin semiconductor product.