Preconditioning via plug material for a via-in-pad ball grid array package

摘要

A method for providing an improved solder joint for a via-in-pad ball grid array package. One or more bonding pads are formed upon a substrate. One or more vias are formed through the substrate within the bonding pad. The vias are plugged with a via plug material. The via plug material is then preconditioned such that an amount of volatiles within the via plug material is reduced.