| 发明名称 |
Deposition method, deposition apparatus, and pressure-reduction drying apparatus |
| 摘要 |
Using a scan coating method, a liquid film is formed on a substrate having a temperature distribution for correcting a temperature distribution of a liquid film caused by the heat of evaporation due to the volatilization of a solvent contained in the liquid film, and then the solvent is removed from the liquid film to form a coating film.
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| 申请公布号 |
US2004089229(A1) |
申请公布日期 |
2004.05.13 |
| 申请号 |
US20030697317 |
申请日期 |
2003.10.31 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
EMA TATSUHIKO;ITO SHINICHI |
| 分类号 |
B05C9/12;B05D1/02;B05D1/26;B05D3/02;G03F7/16;H01L21/027;(IPC1-7):B05D3/00;B05C5/00;B05C15/00;B05B13/02 |
主分类号 |
B05C9/12 |
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