GRAPHICS CARD APPARATUS WITH IMPROVED HEAT DISSIPATION

摘要

Graphics card apparatus (10) with improved heat dissipation and including a planar metallic cover plate (26) having an external perimeter configuration that generally corresponds to the plan-form of the printed circuit board (12) used in the graphics card assembly (10), a plurality of thermal transfer blocks (42-48) that can be selectively affixed to sources of thermal energy on the graphics card assembly (10) and thermally coupled to the cover plate (26), and a fan (36) and carriage (34) therefor comprised of a heat sink and flow directing structure. Heat generated by the active board elements is transferred to the thermal blocks (42-48), sinked in part to the cover plate (26) and ultimately removed from blocks (42-48) and plate (26) by air flow drawn into and through thermal baffles or vanes (62) in the cooling structure. The outer surface of the cover plate (26) also provides a broad surface upon which the manufacturer or marketer can display artwork, trademarks or other decorative indicia.