SEMICONDUCTOR WAFER INSPECTING METHOD AND APPARATUS

摘要

PURPOSE: A semiconductor wafer inspecting method and its apparatus are provided to be capable of checking a recognition pattern. CONSTITUTION: A semiconductor wafer is loaded on an XY stage(S200). The first scanning process is performed on a recognition pattern formed on the semiconductor wafer by irradiating laser beam(S300). The first scattering light is detected according to the irradiation of laser beam(S400). The first image data of the recognition pattern is formed by using the first scattering light(S500). The recognition code of the semiconductor wafer is checked by processing the first image data(S600). The second scanning process is performed on a circuit pattern formed on the semiconductor wafer by irradiating laser beam(S700). The second scattering light is detected according to the irradiation of laser beam(S800). The second image data of the circuit pattern is formed by using the second scattering light(S900). The defect of the circuit pattern is then checked by processing the second image data(S1000).