SEMICONDUCTOR MODULE, ITS MANUFACTURING METHOD, TRAY FOR MANUFACTURING SEMICONDUCTOR MODULE, SEMICONDUCTOR MODULE MANUFACTURING DEVICE, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor module in which a very small semiconductor chip is mounted on a substrate with ease, and to provide a method, a tray and a device for manufacturing it, and an electronic apparatus.

SOLUTION: Related to a plurality of semiconductor chips 11a, 11b, 11c and 11d, bumps 12a, 12b, 12c and 12d of different height ha, hb, hc and hd are provided to each of the semiconductor chips, respectively. The bumps 12a, 12b, 12c and 12d are bonded to a substrate 10 in the order corresponding to the height of the bumps 12a, 12b, 12c and 12d.

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