MANUFACTURING METHOD OF MULTILAYER PRINTED CIRCUIT BOARD FOR HIGH FREQUENCY

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed circuit board by which the transmission loss of an electric signal in high frequency use can be reduced and close adhesion property of a copper circuit and resin can be improved.

SOLUTION: An inner layer circuit substrate is formed by providing the copper circuit on the surface of a resin insulation layer with a copper foil of≤2.0μm surface roughness. The surface roughness of the copper circuit is lowered to be≤2.5μm by performing inner layer treatment to the surface of the copper circuit provided on this inner layer circuit substrate. After this, the resin insulation layer is overlapped on the surface of the inner layer circuit substrate to form a multilayered laminate. The adhesiveness of the copper circuit and the resin can be improved by performing the inner layer treatment to the surface of the copper circuit. The transmission loss of an electric signal in high frequency use can be reduced by setting the upper limit of the surface roughness of the copper circuit after the inner layer treatment to be 2.5μm.

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