发明名称 MULTILAYER PRINTED CIRCUIT SUBSTRATE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multilayer printed circuit substrate which can form a highly fine pattern, which can be formed in a simple step and which does not have a problem of a waste liquid treatment. <P>SOLUTION: The multilayer printed circuit substrate includes at least two laminated wiring boards each having a characteristic change layer for changing characteristics by an operation of the photocatalyst and a conductive pattern formed along the pattern changed in the characteristics of the changing layer. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004140081(A) 申请公布日期 2004.05.13
申请号 JP20020301797 申请日期 2002.10.16
申请人 DAINIPPON PRINTING CO LTD 发明人 YAMAMOTO MANABU
分类号 G03F7/20;H01L23/12;(IPC1-7):H01L23/12 主分类号 G03F7/20
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