发明名称 METHOD OF TRANSFERRING THIN FILM DEVICE AND METHOD OF MANUFACTURING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of transferring thin film device by which an object to be peeled can be peeled easily regardless of the characteristics, conditions, etc., of the object and, particularly, the object can be transferred to various types of transfer bodies. SOLUTION: The method of transferring thin film device, in which a layer to be transferred formed on a substrate through a separation layer and containing a thin film device is peeled off from the substrate and transferred to a transfer body, includes a step of disposing the transfer body on one side of the layer to be transferred opposite to the substrate and a step of transferring the layer to the transfer body by peeling off the layer from the substrate at the inside and/or interface of the separation layer. The front and rear surfaces of the layer are made equal to those when the layer is formed on the substrate by performing the transfer a plurality of times. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004140380(A) 申请公布日期 2004.05.13
申请号 JP20030382626 申请日期 2003.11.12
申请人 SEIKO EPSON CORP 发明人 SHIMODA TATSUYA;INOUE SATOSHI;MIYAZAWA WAKAO
分类号 H01L21/20;H01L21/02;H01L21/336;H01L27/12;H01L29/786;(IPC1-7):H01L27/12 主分类号 H01L21/20
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