| 摘要 |
PROBLEM TO BE SOLVED: To provide a miniaturized ceramic substrate prepared for a thermoelectric exchanging module and effectively preventing the side faces of adjacent electrodes from being short-circuited by solder. SOLUTION: In the ceramic substrate 1 for the thermoelectric exchanging module, a plurality of electrodes 2 on which thermoelectric elements 3 are respectively fixed through solder 4 containing tin are respectively independently formed on one main surface of the ceramic substrate 1. Each electrode 2 is constituted of successively laminating a copper layer 2a, a nickel layer 2b with which the exposed surface of the copper layer 2a is coated, and a metallic plating layer 2c comprising gold, tin or solder containing tin and applied so that the portion of the nickel layer 2b is exposed as the side face of the electrode 2. COPYRIGHT: (C)2004,JPO
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