发明名称 SOLUBLE POLYIMIDE FOR PHOTOSENSITIVE POLYIMIDE PRECURSOR AND PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITION COMPRISING THE SAME
摘要 PURPOSE: Provided is a soluble polyimide, which manifests high resolution and low film shrinkage on curing a micropattern, and gives a film having excellent chemical and physical properties after curing. CONSTITUTION: The soluble polyimide for a photosensitive polyimide precursor is represented by formula 1 and comprises a reactive end-capping group at either or both ends thereof, wherein X is a tetravalent aromatic or aliphatic organo-group; Y is a divalent aromatic or aliphatic organo-group; each of R1 and R2 is H or a monovalent organo-group of CH2OR3, in which R3 is a C6 or lower alkyl group, if both R1 and R2 are not H; and m is an integer of 10 to 1000.
申请公布号 KR20040040662(A) 申请公布日期 2004.05.13
申请号 KR20020068850 申请日期 2002.11.07
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JUNG, MYEONG SEOP;JUNG, SEONG GYEONG;PARK, YONG YEONG;YANG, SANG YUN
分类号 G03F7/004;C08F299/02;C08G73/10;G03F7/027;G03F7/038;G03F7/039;G03F7/075;H01L21/027;(IPC1-7):G03F7/004 主分类号 G03F7/004
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