发明名称 |
SOLUBLE POLYIMIDE FOR PHOTOSENSITIVE POLYIMIDE PRECURSOR AND PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITION COMPRISING THE SAME |
摘要 |
PURPOSE: Provided is a soluble polyimide, which manifests high resolution and low film shrinkage on curing a micropattern, and gives a film having excellent chemical and physical properties after curing. CONSTITUTION: The soluble polyimide for a photosensitive polyimide precursor is represented by formula 1 and comprises a reactive end-capping group at either or both ends thereof, wherein X is a tetravalent aromatic or aliphatic organo-group; Y is a divalent aromatic or aliphatic organo-group; each of R1 and R2 is H or a monovalent organo-group of CH2OR3, in which R3 is a C6 or lower alkyl group, if both R1 and R2 are not H; and m is an integer of 10 to 1000.
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申请公布号 |
KR20040040662(A) |
申请公布日期 |
2004.05.13 |
申请号 |
KR20020068850 |
申请日期 |
2002.11.07 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JUNG, MYEONG SEOP;JUNG, SEONG GYEONG;PARK, YONG YEONG;YANG, SANG YUN |
分类号 |
G03F7/004;C08F299/02;C08G73/10;G03F7/027;G03F7/038;G03F7/039;G03F7/075;H01L21/027;(IPC1-7):G03F7/004 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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