WAFER DRYING METHOD AND APPARATUS

摘要

PURPOSE: A wafer drying method and its apparatus are provided to be capable of preventing the generation of water spot and particle due to the contact between a wafer and a support part under a wafer drying process. CONSTITUTION: A wafer is vertically loaded in a container(S100). Both sides of the wafer are supported(S200). The first drying process is performed on the wafer(S300). The lower portion of the wafer is supported and the support for both sides of the wafer is dissolved(S400). The second drying process is performed on the wafer(S500). Then, the wafer is unloaded from the container(S600). Preferably, a rinsing process is carried out before the first drying process(S210). Preferably, deionized water is stored in the container when loading the wafer in the container, so that the rinsing process is performed by using the deionized water.