| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed board and its manufacturing method by which a resist accurately flows into a via hole and solder is reliably prevented from adhering to the inside of the via hole. SOLUTION: The printed board 1 is subjected to resist printing 5 and silk printing 6 after forming a through hole VH in it. When the diameter of the through hole is defined as d, the diameter of a resist hole which is printed on the through hole is defined as r and the diameter of silk printing hole which is applied to the through hole is defined as s, resist treatment is performed under a condition r<t. After the resist treatment, and silk printing 6 is further applied to the through hole under a condition s<d. In this way, a resist coating and a second coating by silk printing are layered on the through hole VH. COPYRIGHT: (C)2004,JPO
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