| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroplating device and a method for electroplating a BGA board without using a work sheet for interconnecting electroplating leading wires. SOLUTION: The electroplating device for electroplating the BGA board is equipped with the BGA board 10 where a conductive silicone rubber 14 is cold-welded to either of its surfaces, a electroplating tank where the BGA board 10 on which the conductive silicone rubber 14 is cold-welded is inserted, and an electrode plate which is arranged inside the electroplating tank so as to confront the BGA board 10. The BGA board 10 is provided with a ball pad 11a formed on its one surface 11 and a bonding pad 12a formed on its other surface 12, and the ball pad 11a and the bonding pad 12a are electrically connected together through the intermediary of a through-hole 16. The electrode plate and the conductive silicone rubber 14 are made to serve as electrodes to carry out an electroplating process. COPYRIGHT: (C)2004,JPO
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