| 摘要 |
PROBLEM TO BE SOLVED: To realize suppressing of a decrease in reliability of a probe card by removing impurities adhered to a tip of a probe terminal of the card used to inspect a semiconductor integrated circuit device. SOLUTION: First, a substrate 11 to be cleaned having an impurity removing part 11a is held on a substrate holding region 12a of a holder 12. Then, bumps 100a of the probe card 100 are disposed on an upper side of the substrate 11 so as to be opposed to the removing part 11a, and a space surrounded by a sealing ring 15 in a region between the holder 12 and the card 100 is sealed by bringing the ring 15 into contact with the card 100 to form a sealing space 18. Subsequently, the space 18 is pressure reduced from a sealing pressure reducing piping 17 through a sealing pressure reducing passage 16, and hence the bumps 100a are pressed to the removing part 11a of the substrate 11. COPYRIGHT: (C)2004,JPO
|
