摘要 |
PURPOSE: A local cleaning apparatus is provided to be capable of supplying high clean air at the minimum space alone of a wafer region in a clean room. CONSTITUTION: A local cleaning apparatus(1) is provided with a fan unit(2) for sucking the room air of a clean room(100) and dispersing the room air along a suction path installed at its inner portion, an ULPA filter(3) for collecting and removing the particles existing in the room air, and an ionizer(5) for generating process air by supplying positive ions to the clean air. The local cleaning apparatus further includes a local clean space(8) for carrying out a wafer manufacturing and transferring process by using the process air, an air flow controller for controlling the flow rate and direction of the process air in order to be uniformly supplied with the process air to the local clean space, and an MC controller for recovering the normal state pressure difference between the clean room and the local cleaning apparatus.
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