A heat removal system comprising a gas supply, a duct, and a heatsink is presented. The gas supply may be realized as a fan, a blower, or a compressed gas source and is located remotely from the heatsink. The duct provides a passageway for delivering high velocity gas from the gas supply to the first heat sink. The duct includes a plurality of vanes for reducing the turbulence and air boundary separation within the duct. The heatsink is in thermal communication with a heat-producing device such as a microprocessor.
