SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR, AND PLATING SOLUTION

摘要

The present invention relates to relates to a semiconductor device and a method for manufacturing the same having an embedded interconnect structure in which an electric conductor, such as copper or silver, is embedded in fine recesses for interconnects formed in the surface of a semiconductor substrate, and having a protective film formed on the surface of the interconnects to protect the interconnects. The semiconductor device having an embedded interconnect structure, including a protective film formed selectively on the surface of exposed interconnects, wherein the protective film has a flattened surface.