发明名称 |
LOADLOCK CHAMBER HAVING CORROSION-PREVENTING LAYER |
摘要 |
PURPOSE: A loadlock chamber having a corrosion-preventing layer is provided to prolong the lifetime of the loadlock chamber and prevent the wafer transiently stored in the chamber from being contaminated. CONSTITUTION: A loadlock chamber of semiconductor etching equipment includes a corrosion preventing layer coated on its inner wall and the surface of a stage. Preferably, the corrosion preventing layer is made of one selected from a group consisting of Al2O3, AlC, TiN, and AIN. Preferably, the corrosion preventing layer has a thickness of 30-600 μm. Preferably, the corrosion preventing layer is completed by sequentially coating an phosphor nickel layer(31) and a ceramic layer(32) on the surface(21) of the chamber.
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申请公布号 |
KR20040040104(A) |
申请公布日期 |
2004.05.12 |
申请号 |
KR20020068435 |
申请日期 |
2002.11.06 |
申请人 |
DONGBU ELECTRONICS CO., LTD. |
发明人 |
KIM, GYEONG HWAN;PARK, U CHEOL |
分类号 |
H01L21/02;(IPC1-7):H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
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主权项 |
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地址 |
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