发明名称 |
Improved diebond strip |
摘要 |
The present invention discloses a Titanium alloy strip (50) which has a reduced cross section in the central region (70) of the strip. By concentrating heat in this central region the process of bonding laser devices to a substrate is greatly improved. Furthermore, the present invention allows for the possibility of removing the laser device from the substrate without destroying the laser device. |
申请公布号 |
GB2377402(B) |
申请公布日期 |
2004.05.12 |
申请号 |
GB20010016990 |
申请日期 |
2001.07.12 |
申请人 |
* AGILENT TECHNOLOGIES INC |
发明人 |
MAHESHCHANDR * MISTRY;CHRISTOPHER * MAIN |
分类号 |
H01L21/52;B23K1/00;(IPC1-7):B23K3/047;H05B3/10;H05K13/04;H05B3/40 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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