| 摘要 |
Optical devices, such as a laser diode 130 and a waveguide 135, are fabricated onto separate substrates 100, and 150, respectively. Both devices have optical confinement regions defined by core layers 115 and 140. The laser diode 130 and waveguide 135 are flip chip mounted by means of their bonding surfaces 155 and 160 onto a shared substrate 110. The depth of the layers above the optical confinement region is closely controlled during fabrication so that when the devices are subsequently flip chip mounted they are precisely aligned. |
