| 摘要 |
PURPOSE: A method for testing a semiconductor device is provided to easily find defective elements that are regular in each die by comparing a yield of each die constituting a wafer with an average yield of peripheral dies surrounding the die and by determining and displaying whether the local yield of each die varies. CONSTITUTION: The yield of each die(X,A,B,C,D) of the wafer is measured. The average yield of the dies in the periphery of a specific die among the dies is obtained. The average yield of the peripheral dies is compared with the yield of the specific die to test the die, wherein a die with a defective element and a die without a defective element are divided according to the comparison value.
|
