发明名称 |
Techniques for improving wordline fabrication of a memory device |
摘要 |
Fabrication techniques for making a semiconductor device. More specifically, techniques for fabricating a wordline in a memory device are provided. Specific heat treatments may be added to the process flow to remove or weaken certain layers formed in the wordlines. For instance, an SiNx layer and a crystallized W2N layer may form during the fabrication of the wordline. While the layers may provide certain advantages at certain points in the fabrication process, they may be undesirable at subsequent points. One or more anneal processes may be implemented at various points in the processing to eliminate the crystallized W2N layer and weaken the SiNx layer. |
申请公布号 |
US6734089(B1) |
申请公布日期 |
2004.05.11 |
申请号 |
US20030345542 |
申请日期 |
2003.01.16 |
申请人 |
HU YONGJUN JEFF;BEDGE SATISH;TOREK KEVIN |
发明人 |
HU YONGJUN JEFF;BEDGE SATISH;TOREK KEVIN |
分类号 |
H01L21/768;H01L21/8239;H01L21/8242;H01L21/8244;H01L27/105;H01L27/108;(IPC1-7):H01L21/320;H01L21/476;H01L21/336 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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