发明名称 |
Method for forming a wafer level chip scale package, and package formed thereby |
摘要 |
A method for fabricating a chip scale package is described. The method utilizes wafer level processes to obtain a chip level package. The method particularly avoids the use of mechanical grinding by the novel use of molding, extruding, and etching technology.
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申请公布号 |
US6732913(B2) |
申请公布日期 |
2004.05.11 |
申请号 |
US20020315534 |
申请日期 |
2002.12.10 |
申请人 |
ADVANPACK SOLUTIONS PTE LTD. |
发明人 |
ALVAREZ ROMEO EMMANUEL P. |
分类号 |
H01L23/31;H01L23/485;(IPC1-7):B23K35/14 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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