发明名称 |
Semiconductor device |
摘要 |
Each lead frame for a power chip has one side main surface on which a power chip is mounted and a suspension lead part provided projectingly from a region reserved for forming mold resin in addition to a lead terminal. Thus, the lead frame can be supported by the plurality of suspension lead parts in a molding step. A metal block is provided on the other main surface of the lead frame to face the power chip. Consequently, a semiconductor device with good heat radiation properties and good insulation breakdown voltages can be obtained.
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申请公布号 |
US6734551(B2) |
申请公布日期 |
2004.05.11 |
申请号 |
US20020126606 |
申请日期 |
2002.04.22 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
YOSHIHARA HIROYUKI;HAYASHI KENICHI;KAWAFUJI HISASHI;TAJIRI MITSUGU |
分类号 |
H01L25/07;H01L23/36;H01L23/433;H01L23/495;H01L25/18;(IPC1-7):H01L23/10 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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