发明名称 |
Semiconductor device and microrelay |
摘要 |
In one embodiment, a semiconductor device having single or multi-layer intermediate layers that easily adhere to a glass frit and lead lines of respective interconnections is disclosed. In general, the single or multi-layer intermediate layers are formed on at least the top surfaces of portions of the respective lead lines on which the glass frit is placed.
|
申请公布号 |
US6734513(B2) |
申请公布日期 |
2004.05.11 |
申请号 |
US20010999250 |
申请日期 |
2001.11.01 |
申请人 |
OMRON CORPORATION |
发明人 |
SEKI TOMONORI;KOGURE TOMONARI |
分类号 |
H01L23/02;B81B7/00;H01L23/10;(IPC1-7):H01L43/00 |
主分类号 |
H01L23/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|