发明名称 Water-based resin composition
摘要 A thermosetting water-based resin composition comprising an oil-soluble initiator of which a temperature for one-minute half-life is from 90° to 270 ° C. and a polycondensation resin comprising an unsaturated dicarboxylic acid having a radical-polymerizable unsaturated bond or an acid anhydride thereof as at least one constituent monomer, wherein the polycondensation resin has an acid value of from 3 to 100 mg KOH/g, and wherein said oil-soluble initiator is present in said polycondensation resin; a process for preparing the thermosetting water-based resin composition; a molding compound composition comprising the water-based resin composition; and a molding product prepared by molding the molding compound composition.
申请公布号 US6734228(B1) 申请公布日期 2004.05.11
申请号 US20010936428 申请日期 2001.09.13
申请人 KAO CORPORATION 发明人 SAKUMA TADASHI;KAWABE KUNIYASU
分类号 C08F283/01;C08G63/676;C08K5/14;C08L67/06;C08L67/07;(IPC1-7):C08K9/10 主分类号 C08F283/01
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