发明名称 |
Water-based resin composition |
摘要 |
A thermosetting water-based resin composition comprising an oil-soluble initiator of which a temperature for one-minute half-life is from 90° to 270 ° C. and a polycondensation resin comprising an unsaturated dicarboxylic acid having a radical-polymerizable unsaturated bond or an acid anhydride thereof as at least one constituent monomer, wherein the polycondensation resin has an acid value of from 3 to 100 mg KOH/g, and wherein said oil-soluble initiator is present in said polycondensation resin; a process for preparing the thermosetting water-based resin composition; a molding compound composition comprising the water-based resin composition; and a molding product prepared by molding the molding compound composition.
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申请公布号 |
US6734228(B1) |
申请公布日期 |
2004.05.11 |
申请号 |
US20010936428 |
申请日期 |
2001.09.13 |
申请人 |
KAO CORPORATION |
发明人 |
SAKUMA TADASHI;KAWABE KUNIYASU |
分类号 |
C08F283/01;C08G63/676;C08K5/14;C08L67/06;C08L67/07;(IPC1-7):C08K9/10 |
主分类号 |
C08F283/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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