Electronics component assembly in a tire for remotely monitoring tire conditions

摘要

An improved electronics component assembly in a tire is provided. The assembly includes a tire and an electronics package for communicating information from the tire to a remote location. The electronics package is located inside of the tire and is connected to an inner portion of the tire. At least a first antenna wire is located inside of the tire and is connected to a portion of the tire. The first antenna wire is connected to the electronics package. The at least first antenna wire is connected to the electronics package so that tension in the at least first antenna wire imparts compression on the electronics package. Additionally, other exemplary embodiments of the present invention exist as previously stated were a second antenna wire is present in order to help impart compression on the electronics package. Also, other arrangements of the improved electronics component assembly are possible that impart shear or torsion alternatively or in addition to compression on the electronics package.