发明名称 |
Thermal management apparatus for horizontal electronics enclosures |
摘要 |
A reconfigurable apparatus for thermal management of an electronics module is described. The apparatus includes a pair of fans generating airflow along respective fan axes. The apparatus also includes a beat sink having one portion disposed in the airflow of the fans and another portion adapted for thermal coupling with the electronics module. The airflows from the fans are in the same direction when the apparatus is arranged in a front-to-back airflow configuration and the airflows are in opposite directions when the apparatus is arranged in a front-to-front airflow configuration. A removable flow director is included in the apparatus when the apparatus is in the front-to-front airflow configuration to direct the airflow from the first fan towards the second fan.
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申请公布号 |
US6735081(B1) |
申请公布日期 |
2004.05.11 |
申请号 |
US20030445753 |
申请日期 |
2003.05.27 |
申请人 |
NORTEL NETWORKS LIMITED |
发明人 |
BISHOP MICHAEL;CHEN EDWARD |
分类号 |
H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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