| 摘要 |
A heat-conducting device for conducting heat between a circuit board and an airframe of a missile includes a thermal plane onto which the circuit board is mounted, and a pair of feet that partially protrude from the slots in the thermal plane. Slot-engaging portions of the feet freely float within the slots, allowing repositioning of the feet in two dimensions relative to the slots. Resilient devices such as springs urge outer portions of the feet into contact with the airframe. Locking mechanisms may prevent extension of the feet until after the heat-conducting device is installed in the missile. The feet self-align into contact with the airframe, automatically adjusting to compensate for misalignment and/or warping.
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