发明名称 EEPROM with reduced manufacturing complexity
摘要 A semiconductor device (200) comprising a semiconductor substrate (210) having source and drain regions (530, 540) located in the semiconductor substrate (210) and having similar doping profiles, wherein a channel region (550) extends from the source region (530) to the drain region (540). The semiconductor device (200) also comprises a dielectric layer (230) located over the source and drain regions (530, 540), the dielectric layer (230) having first and second thicknesses (T1, T2) wherein the second thickness (T2) is substantially less than the first thickness (T1) and is partially located over the channel region (550). The semiconductor device (200) also comprises a gate (510) located over the dielectric layer (230) wherein the second thickness (T2) is located between an end (515) of the gate (510) and one of the source and drain regions (530, 540).
申请公布号 US6734491(B1) 申请公布日期 2004.05.11
申请号 US20020331705 申请日期 2002.12.30
申请人 TEXAS INSTRUMENTS DEUTSCHLAND GMBH 发明人 MITROS JOZEF C.;KHAN IMRAN;NEHRER WILLIAM;HUTTER LOU;PREIKSZAT DIRK
分类号 H01L21/28;H01L27/115;H01L29/423;(IPC1-7):H01L29/788 主分类号 H01L21/28
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