发明名称 |
Surface laminar circuit board having pad disposed within a through hole |
摘要 |
A surface laminar circuit board includes an insulating layer, and a signal ground conductive layer disposed on an upper surface of the insulating layer. The conductive layer has a hole formed therein. A photosensitive dielectric layer is disposed on an upper surface of the signal ground conductive layer. The dielectric layer has a photo micro-via formed therein. A signal trace is disposed on the photosensitive dielectric layer, and is electrically coupled with the signal ground conductive layer by way of the photo micro-via. A conductive pad is provided, which has a majority thereof within an area defined by an outer periphery of the hole. The conductive pad is electrically coupled with the signal trace. A surface mounted component is mounted on the conductive pad.
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申请公布号 |
US6734369(B1) |
申请公布日期 |
2004.05.11 |
申请号 |
US20000651334 |
申请日期 |
2000.08.31 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BAILEY MARK J.;SHEA MICHAEL JOHN;SWIFT GERALD WAYNE |
分类号 |
H05K1/02;H05K1/18;H05K3/00;H05K3/46;(IPC1-7):H05K1/03 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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