发明名称 |
Electrically conductive paste and semiconductor device prepared by using the paste |
摘要 |
An electrically conductive paste comprises 80% by weight or more of silver powder and 20% by weight or less of a thermosetting resin. The silver powder has a particle size distribution having two peaks at specific positions. Viscosities of the paste measured under a low shearing stress and under a high shearing stress are in respective specific ranges and the ratio of these viscosities is in a specific range. A cured product obtained by heating the paste has a tensile modulus in a specific range. The paste has thermal and electric conductivities approximately the same as those of solder, shows little change in properties under a high temperature and a high humidity or under cyclic cooling and heating, exhibits excellent workability in coating and can be applied to coating by using nozzles having a wide range of diameters. A reliable semiconductor device is prepared by using the paste. |
申请公布号 |
US6733695(B2) |
申请公布日期 |
2004.05.11 |
申请号 |
US20020176377 |
申请日期 |
2002.06.21 |
申请人 |
SUMITOMO BAKELITE COMPANY LTD. |
发明人 |
ONAMI KAZUTO;TAKEDA TOSHIRO;FUKUIZUMI AKIRA;NAKAJIMA YOSHIHIRO |
分类号 |
C09D5/24;C09J4/02;C09J9/02;C09J163/00;C09J201/00;H01B1/22;H01L21/52;H01L21/60;(IPC1-7):H01B1/22 |
主分类号 |
C09D5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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