发明名称 |
Component built-in module and method for producing the same |
摘要 |
A component built-in module including a core layer formed of an electric insulating material, and an electric insulating layer and a plurality of wiring patterns, which are formed on at least one surface of the core layer. The electric insulating material of the core layer is formed of a mixture including at least an inorganic filler and a thermosetting resin. At least one or more of active components and/or passive components are contained in an internal portion of the core layer. The core layer has a plurality of wiring patterns and a plurality of inner vias formed of a conductive resin. The electric insulating material formed of the mixture including at least an inorganic filler and a thermosetting resin of the core layer has a modulus of elasticity at room temperature in the range from 0.6 GPa to 10 GPa. Thus, it is possible to provide a thermal conductive component built-in module capable of filling the inorganic filler with high density; burying the active component such as a semiconductor etc. and the passive component such as a chip resistor, a chip capacitor, etc. in the internal portion of the substrate; and simply producing a multilayer wiring structure.
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申请公布号 |
US6734542(B2) |
申请公布日期 |
2004.05.11 |
申请号 |
US20010033322 |
申请日期 |
2001.12.27 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
NAKATANI SEIICHI;SUGAYA YASUHIRO;ASAHI TOSHIYUKI;KOMATSU SHINGO |
分类号 |
H01L21/48;H01L23/48;H01L23/498;H01L23/538;H05K1/18;H05K3/20;H05K3/40;H05K3/46;(IPC1-7):H01L23/24;H01L23/34;H05K1/00;H05K1/03;H05K7/10 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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