| 发明名称 |
Die attachment with reduced adhesive bleed-out |
| 摘要 |
An organic chip carrier having metallic circuitry and wire bond pads thereon is bonded to an integrated circuit die by a photocurable adhesive and is electrically connected therewith by wire bonding to the wire bond pads.
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| 申请公布号 |
US6734569(B2) |
申请公布日期 |
2004.05.11 |
| 申请号 |
US20020316267 |
申请日期 |
2002.12.12 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
APPELT BERND KARL;JOHANSSON GARY ALAN;PAPATHOMAS KONSTANTINOS I. |
| 分类号 |
H01L21/60;H01L21/52;H01L21/58;H01L21/607;(IPC1-7):H01L23/48;H01L23/52;H01L29/40;B32B33/00;B05B31/00 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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