发明名称 Method of forming an air gap within a structure by exposing an ultraviolet sensitive material to ultraviolet radiation
摘要 An ultraviolet sensitive material may be formed within a semiconductor structure covered with a suitable hard mask. At an appropriate time, the underlying ultraviolet sensitive material may be exposed to ultraviolet radiation, causing the material to exhaust through the overlying hard mask. As a result, an air gap may be created having desirable characteristics as a dielectric.
申请公布号 US6734094(B2) 申请公布日期 2004.05.11
申请号 US20020134264 申请日期 2002.04.29
申请人 INTEL CORPORATION 发明人 KLOSTER GRANT M.;LEU JIHPERNG;PARK HYUN-MOG
分类号 H01L21/764;H01L21/768;(IPC1-7):H01L21/764 主分类号 H01L21/764
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