| 摘要 |
The invention relates to a thermosetting resin composition comprising: a binder containing a thermosetting resin having a storage elastic modulus of 1,000 MPa or less at 20 DEG C and an elongation of 10% or more at 20 DEG C; and an inorganic filler in an amount of 100 to 2,000 parts by weight with respect to 100 parts by weight of the binder. According to the invention, it provides a thermosetting resin composition and resin film which have a low thermal expansion coefficient and able to possess a low elastic modulus, a high extensibility, and a low thermal expansion coefficient. |
